MICROELECTRONICS INTERNATIONAL

微电子国际提供了一个权威的、国际的和独立的论坛，在这个快速发展和变化的技术领域内，对与先进封装、微电路工程、互连、半导体技术和系统工程相关的研究和开发、应用、过程和当前实践进行关键评估和传播。它代表了一种当前的、全面的、实用的信息工具。该杂志包括一个多学科研究的各种技术，过程和当前的实践与设计，制造，装配和各种应用的微型电子设备和先进的软件包。

Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering within this fast moving and changing technological field. It represents a current, comprehensive and practical information tool. The journal comprises a multi-disciplinary study of the various technologies, processes and current practices associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages.