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MICROELECTRONIC ENGINEERING

来源: 树人论文网 浏览次数:220次
创刊时间:1983
周期:Monthly
ISSN:0167-9317
影响因子:1.654
是否开源:No
年文章量:284
录用比:容易
学科方向:工程:电子与电气
研究方向:工程技术
通讯地址:ELSEVIER SCIENCE BV, PO BOX 211, AMSTERDAM, NETHERLANDS, 1000 AE
官网地址:http://www.journals.elsevier.com/microelectronic-engineering/
投稿地址:http://ees.elsevier.com/mee/
网友分享经验:约6.0个月

MICROELECTRONIC ENGINEERING杂志中文介绍

《微电子工程》拥有开放获取的镜像期刊《微纳工程》,目标和范围相同,编辑团队、投稿系统和严格的同行评审。《微电子工程》是一本以电子、光子、生物电子、机电和流体设备及系统的制造为主要内容的纳米加工和纳米技术期刊。它还涵盖了“超过摩尔”和“超越摩尔”集成纳米电子/光子学和微/纳米/生物系统的不断扩展的跨学科领域。通过其独特的混合同行评审文章,评论,加速出版物,简短和技术说明,以及最新的研究新闻的关键发展,微电子工程提供了这一令人兴奋的,跨学科的和动态的学术界和工业界的研究人员的新领域的全面报道。该杂志涉及以下主题,并考虑的主要是实验工作,或理论/模拟工作直接联系和支持该领域的实验:微电子加工与材料(光刻、自组装、等离子体加工、金属化、3D集成、相关材料等)微/纳米工程/制造/技术/制造纳米电子和光子器件及其制备微系统、微器件(如传感器和纳米能源器件)及其制造微流体、生命科学设备/传感器,以及集成芯片实验室及其制造

MICROELECTRONIC ENGINEERING杂志英文介绍

Microelectronic Engineering has an open access mirror journal Micro and Nano Engineering, sharing the same aims and scope, editorial team, submission system and rigorous peer review.Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.The journal addresses the following topics and considers mostly experimental work, or theoretical / simulation work directly linked and supporting experiments in the fields:Microelectronics processing & materials (Lithography, Self-assembly, Plasma Processing, Metallization, 3D Integration, Related Materials….)Micro-/Nano-engineering / fabrication / technology / manufacturingNanoelectronic and photonic devices and their fabricationMicrosystems, microdevices (e.g., sensors and nanoenergy devices) and their fabricationMicrofluidics, life science devices /sensors, as well as integrated Lab-on-a-chip and their fabrication

MICROELECTRONIC ENGINEERING影响因子

工程:电子与电气领域相关期刊
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