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IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY

来源: 树人论文网 浏览次数:228次
周期:Quarterly
ISSN:0018-9375
影响因子:2.274
是否开源:No
年文章量:238
录用比:容易
学科方向:工程:电子与电气
研究方向:工程技术
通讯地址:IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
官网地址:http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=15
投稿地址:http://mc.manuscriptcentral.com/temc-ieee
网友分享经验:约2.0个月

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY杂志中文介绍

《IEEE电磁兼容性汇刊》发表了与电磁兼容性(EMC)所有学科和相关方法相关的原始和重要贡献,以预测、评估和预防电磁干扰(EMI)并提高设备/产品的抗扰度。本出版物的范围包括但不限于电磁环境;干扰控制;电磁兼容性和电磁干扰建模;大功率电磁学;电磁兼容性标准、电磁兼容性测量方法;计算电磁学和信号及功率完整性,如适用或与电磁兼容性问题直接相关;传输通信线路;静电放电和雷电效应;无线和光学技术中的电磁兼容性;印刷电路板和系统设计中的电磁兼容性。

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY杂志英文介绍

IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY影响因子

工程:电子与电气领域相关期刊
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